Full Site - : flip-chip (Page 7 of 129)

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

Industry News | 2023-03-16 14:59:50.0

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Papers Awards at Apex 2001.

Industry News | 2001-01-23 10:47:30.0

IPC has recognized the winners of this year's Best U.S. and International Paper awards at IPC SMEMA Council's Electronics Assembly Process Exhibition and Conference (APEXSM) in San Diego, CA.

Association Connecting Electronics Industries (IPC)

SMTA Announces Pan Pacific Symposium Call for Participation

Industry News | 2003-05-27 08:13:23.0

The Ninth Annual Pan Pacific Microelectronics Symposium

Surface Mount Technology Association (SMTA)

Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16

Industry News | 2008-01-07 14:27:27.0

Expands to Four-Day Event with Workshops, Presentations and Exhibits

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Call For Presentations: IPC Conference on Assembly Reliability

Industry News | 2011-04-01 13:21:14.0

IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK's LED Dispensing Applications Highlighted at LED Korea, Booth #4228, Hall B

Industry News | 2013-01-28 02:11:23.0

Offers precise, repeatable dispensing of phosphor for coating and encapsulation

ASYMTEK Products | Nordson Electronics Solutions

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:17.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:18.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)


flip-chip searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Selective Soldering Nozzles

High Throughput Reflow Oven
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications