Electronics Forum | Mon Jun 04 23:52:57 EDT 2012 | rway
Actually, if you experience lack of witness marks, you probably have a problem. Witness marks are OK and will not affect your assembly. I assume this is an SMT assembly we are talking about, in which case, this is what your test pads are for. You
Electronics Forum | Wed Jun 19 11:31:33 EDT 2013 | ehess
were you forced to reapply over time? thanks for the input.
Electronics Forum | Fri Jul 26 12:41:43 EDT 2013 | dontfeedphils
Check the centering force, and change it to High, if it isn't already.
Electronics Forum | Mon Mar 12 13:47:05 EDT 2018 | brandon44
I also like to know the difference as well. Thanks!
Electronics Forum | Wed Mar 14 10:46:51 EDT 2018 | brandon44
Thanks for the explanation? I will try for it. lol
Electronics Forum | Mon Dec 03 15:03:49 EST 2018 | dleeper
I can't open your spread sheet to see how you calculate this, but usually this sort of calculation assumes the leads are spaced symmetrically on both sides of the part and the center of mass is between them. Gravity pulls the part down, while the wet
Electronics Forum | Wed Dec 14 14:03:51 EST 2022 | denism
Fuji can place with high force, and custom feeder for your terminals is required.
Electronics Forum | Thu Dec 21 17:04:28 EST 2023 | cyber_wolf
Disable the hydra head.
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Mon Oct 08 02:12:21 EDT 2001 | george
I do not doubt about the power of the 552 and 580, but in some cases it may be overdone. For just a simple (straight forward) shear test, you can also look at: http://www.chatillon.com/products/dpp.html (�Low Capacity Mechanical Force Gauge. These er
