Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef
You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d
Electronics Forum | Tue May 07 15:24:13 EDT 2002 | gregp
I believe Mitutoyo makes a CMM for that application. They were soliciting the idea at APEX show a couple of years ago. I believe they were going to develop some software to do just what you are asking for (following the IPC-9850 format). A CMM, ho
Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef
it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Tue Nov 09 13:36:03 EST 2004 | russ
If I remember correctly since I cannot find my copy of IPC 600, I believe that the 20% reduction applies to "defects" and not the total etch process. By the way what is being used to measure down to .0005"? For this measurement to be correct it wou
Electronics Forum | Tue Nov 22 21:08:45 EST 2005 | davef
CMI International says, there are five basic, non-destructive methods of determining coating thickness. Each method was devised to achieve cost-effective, accurate, and repeatable results. Those methods are: * X-Ray fluorescence * Eddy-current * M
Electronics Forum | Wed May 31 15:50:15 EDT 2006 | tony_d
Hello Barry, I have not had any experience with the Testronics bench top system. I did, however, evaluate MIRTEC, MVP, N-Spec and YESTech. In my opinion, the MVP was simply too complicated and took too long to program for a low volume high mix man
Electronics Forum | Sat Nov 04 07:10:48 EST 2006 | tony_d
Hello bpeach, I recently purchased AOI system for our company. We are a low to mid range manufacturer as well. I looked at several different vendors around the price range that you are looking at incuding; Mirtech, Viscom, N-Spec, Omron, VI Tech, Or
Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp
The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own
