Electronics Forum | Tue May 07 08:04:17 EDT 2002 | Sir Alexandr
Sorry if info is useless, but placement machines must have own system programs for completly ajustment of placement in a gap about 0.01 mm . Also headblock camera has enought increment to found correct place and fiducial setups utility. Maybe your lo
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Fri Jul 12 01:38:06 EDT 2002 | redmary
thanks, Dave. who are specialized in mechnical stress distribution? because I find the gap in the capacitor, but why? If the crack is caused by the exteral mechnical stress, which shape will be formed, zigzag or linear?
Electronics Forum | Thu Aug 29 20:34:02 EDT 2002 | ppwlee
A gap of 150-200� between potential shadow components is enough to eliminate those problems. Dave, Can you clarify? Do you mean 0.015 to 0.02?? Peter
Electronics Forum | Thu May 08 18:49:47 EDT 2003 | slthomas
Russ, Some people don't look into those details. They get into trouble and decide they need to make cuts. Labor rates are the first thing they jump on because there's such an obvious gap between Chinese rates and the rates here. Details, such as t
Electronics Forum | Fri Feb 14 21:57:35 EST 2003 | caldon
Hello All- As per IPC SMEMA Specs the max gap distance should be .375" This standard can be downloaded from IPC's website at http://www.ipc.org/html/fsresources.htm This Doc has a fair amount of useful info. Best Regards, Cal
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.
Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat
Electronics Forum | Fri Jan 14 14:59:52 EST 2005 | russ
We use a 25 x 25 mil square pad with a 18-20mil GAP with great success. Russ
Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
