Electronics Forum: gram (Page 7 of 14)

LOCTITE GC 10

Electronics Forum | Fri Jun 05 17:38:38 EDT 2015 | dontfeedphils

I've been running an eval on it for a little while now. Most impressive thing I've seen so far: Dispensed 100 grams on stencil, printed two solder paste eval PCBs and reflowed, put paste onto sheet of FR4 and let it sit out in the shop next to the

QFN DROP DURING 2ND TIME REFLOW SOLDERING

Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob

You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a

Reflow Oven

Electronics Forum | Tue Aug 13 11:21:04 EDT 2019 | slthomas

A profiler can't distinguish where your heat is coming from, so if you're significantly imbalanced between top and bottom heat (could be an oven problem or your settings) it might still be a cause. You don't say whether or not your top and bottom s

Availability of GRID-LOK

Electronics Forum | Mon Jul 30 12:14:00 EDT 2001 | hinerman

1. The grid-lok technology affords itself the flexibility to come in a variety of heights. The list of machines given are customers we are working with currently. Please contact me offline at jhinerman@ovationproducts.net if you have a specific app

DEK FormFlex

Electronics Forum | Fri Aug 03 12:13:59 EDT 2001 | hinerman

T.A. board lok is fixed tooling. I have not used it, and therefore cannot comment on it. Their website describes it in detail for those interested. -The Grid-Lok system is completely pnuematic -Each pin locks individually via mechanical lock -Each

Re: Calcutating Surface Tension

Electronics Forum | Thu Oct 26 14:40:12 EDT 2000 | ptvianc

Hello: I have not seen a published formula for calculating the package weight that can be secured by molten solder. I have seen forumlas printed for tombstoning. From that aspect, we developed the following rule-of-thumb for first-order estimates:

Grid Lok

Electronics Forum | Tue Jul 31 15:29:45 EDT 2001 | hinerman

Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider th

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 19:45:26 EST 1999 | Deon Nungaray

Deon Response: Hello Will, Yes, you can reflow a double sided board using 63/37 solder paste on both sides. There are some limitations as far as the mass of the components to reflow the second time. If you have doubts or are concerned that a compone

Re: Help with flux residue spec

Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.

Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos

Re: Solder surface tension

Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup

| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s


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