Electronics Forum | Thu Jun 25 10:32:51 EDT 1998 | Gary Simbulan
Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handboo
Electronics Forum | Thu Jan 29 08:33:34 EST 1998 | Mike Moninger
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
Electronics Forum | Wed Feb 27 22:24:28 EST 2002 | davef
I own and have read this book. While it is better than the average soldering book, it is not the first book that I reach for in trying to sort through a problem. It introduces a broad range of soldering methods with a reasonable amount of detail, b
Electronics Forum | Mon Apr 15 18:56:56 EDT 2002 | davef
Hesitating after your shout-out for �DI water rinse experts�, Q1: �What is the FIX industrial standard?� A1: Never heard of �the FIX industrial standard�. There is no standard in the US electronic industry. The issue: * Is NOT the cleanliness of
Electronics Forum | Wed Jan 05 08:58:13 EST 2005 | davef
Q1. Is it enough to use only water while cleaning or is it necessary to use any additional chemistries and/or saponifiers as well? A1. It depends on: * Flux residues that you're cleaning * Standoff of the components * Cleaning technology [we've neve
Electronics Forum | Wed Oct 18 19:52:09 EDT 2006 | davef
Ted Dangelmayer's book [ESD Program Management: A Realistic Approach to Continuous Measurable Improvement in Static Control; Dangelmayer, T; Kluwer Academic Pub 1999 e2; 0412136716] is excellent. Often, ESD supplies sales-types use the "Chicken Littl
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Thu Dec 06 08:57:32 EST 2007 | davef
With this small amount of background information on the situation, comments are: * If you let adhesive cure on your stencil, you should not be using Zestron 301. A hammer and chisel is more effective. * Assuming you are not letting the adhesive cure,
Electronics Forum | Fri Feb 29 14:58:35 EST 2008 | ck_the_flip
Here is a useful website that defines Cpk: http://www.itl.nist.gov/div898/handbook/pmc/section1/pmc16.htm For placement equipment, the manufacturers typically give you a glass plate, where the intent is to measure how far off the centroid you are
Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
