Electronics Forum | Thu Jun 14 21:20:23 EDT 2001 | davef
Aw, don't be such a baby!!! ;-) It's a blank of a lot cheaper than ENIG. Costs about the same as HASL, maybe even cheaper. Why not have your fab build-up a split a lot [er, maybe build a few extra, whatever.] next time you order your "favorite" b
Electronics Forum | Fri Feb 13 19:51:07 EST 2009 | joeherz
Update Received cross-section analysis for ENIG plated boards and am happy to report that we have no voiding issues. Intermetalics look great and no copper dissolution. No process parameters were changed, only the PCB plating. For now, we are onl
Electronics Forum | Mon Feb 14 12:16:10 EST 2000 | Dave F
Steve: Several points: * I don't have any real problems with the paper that you referenced. The hair on the back of my neck did rise a bit when the paper touched-on the higher level of process control required for ENIG. * JAX makes a good point.
Electronics Forum | Fri Jul 15 16:50:04 EDT 2005 | davef
Few of us here on SMTnet fabricate our bare boards. Most of us are assemblers. So, the solderability of the connections of our boards is a BIG issue with us. Our suppliers protect the solderability of the copper by coating the copper to limit the
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Mon Sep 09 21:02:30 EDT 2002 | davef
Bernard Interesting point. Please help us better understand: * Why do 'VIA hole, PTH hole sizes may need to be changed', aside from the obvious with hole-to-lead clearance? * What should the designer 're-evalaute the board before changing'? * What
Electronics Forum | Mon Apr 05 04:50:28 EDT 2004 | harris
Hello: What's the difference of the OSP, HASL, Ni/Au immersion and ENIG? What's the advantage and disadvantage of them, special for the BGA pad? I had seen some discussion in the forum, but they are for a long time ago. Could somesone can give me the
Electronics Forum | Mon Sep 09 11:20:50 EDT 2002 | ksfacinelli
I have never seen that occur when using gold plating vs. HASL. I am a big fan of the gold process and have achieved very consistent quality. Did the board vender do an impedance measure to validate you design?
Electronics Forum | Wed Sep 11 15:49:10 EDT 2002 | stepheno
Are you no clean or WS? Have you used a MultiMeter to verify the ICT failures? Maybe the components are fine but the pins are contaminated. Or the test points. Don't have any reason to suspect that due to HASL vs gold. It's just I don't trust data o
Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup
Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect
