Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Wed Nov 28 07:41:10 EST 2007 | davef
DevGru: Questions are: * What steps do you recommend taking to "watch out for the exothermic heat from the curing?" * What are typical temperatures for exothermic heat from the curing? * What is the duration of such temperatures? * Do epoxy suppliers
Electronics Forum | Fri Aug 12 09:49:19 EDT 2016 | deanm
In general, smaller objects heat up faster than larger objects because they are lower mass. For example if you heat up one liter of water in pan and two liters of water in another pan with the same heat energy applied, the smaller mass will heat up f
Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin
Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri
Electronics Forum | Tue Apr 14 10:21:11 EDT 1998 | EFData
| Does that part still have a heat sink built into it or is it the plastic package? | Justin Originally, we also thought the heat sink may be causing problems, so we conducted tests on both the plastic package and heat sink versions. Nothing conclusi
Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
Electronics Forum | Fri Feb 02 12:37:11 EST 2007 | kennyg
For pads such as a d-pack... what is the effect on heat dissipation of leaving the unsoldered portion of the pad exposed metal or covering with solder mask? Is there a percentage of heat dissipation that is inhibited by covering with mask?
Electronics Forum | Wed Sep 16 09:04:12 EDT 2009 | stepheniii
All the heat that comes off the machine comes from powering the machine. The more heat that comes off it, the more energy that went into the machine. When the machine is cold there is no heat energy leaving the machine. Therefore complete cooldown
Electronics Forum | Thu Aug 30 19:58:24 EDT 2012 | warwolf
What is the actual function of the shortwave IR in the wave machine process? Is it just another heat source?. i know it can apply a lot of heat in quick cycles and has ‘penetrating heat’ but is that it? seems a bit too simple.
Electronics Forum | Tue Feb 14 10:25:04 EST 2017 | swag
Pre-heat, pre-heat, pre-heat! Swap out your acetylene with some propane. Problem solved. Throw a potato in your solder pot while your at it...
