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Best Papers from SMTA International Announced

Industry News | 2024-02-05 14:05:05.0

The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.

Surface Mount Technology Association (SMTA)

Best Technical Conference Papers at IPC APEX EXPO 2024 Selected

Industry News | 2024-03-11 14:58:44.0

New this year, student scholarship awarded by IPC Education Foundation

Association Connecting Electronics Industries (IPC)

ASYMTEK Products Elevates the Excellence of Electronics to New Heights with Advanced Dispensing, Coating, and Software Product Solutions at IPC APEX EXPO - Booth 1611

Industry News | 2020-01-23 17:30:46.0

ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.

ASYMTEK Products | Nordson Electronics Solutions

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Releases schedule of professional development courses

Industry News | 2003-08-27 10:58:00.0

Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting

Association Connecting Electronics Industries (IPC)

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

Industry News | 2015-03-02 21:09:35.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

BGA Thermal Shock Testing

Technical Library | 2007-02-01 09:27:47.0

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.

BEST Inc.

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

New Equipment | Rework & Repair Equipment

BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It

BEST Inc.

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.


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