Electronics Forum | Mon Aug 15 09:34:37 EDT 2016 | sarason
The screens are basically the same technology. But when I worked with them , the screens were 6 inches square for a 3 or 4 inch hybrid. It is used on a precision printing machine to get good alignmant. Tee- shirts use a bigger stencil and are not so
Electronics Forum | Wed Jul 18 10:16:08 EDT 2018 | ir11
Thank you for your response and information. I don't have any idea on what is Hybrid Circuits but if I will use ceramic PCB does my current SMT line need to change which running FR4 PCB material? My apologized for my queries. Thank you. IR11
Electronics Forum | Fri Jan 24 01:46:29 EST 2020 | sara_pcb
I am designing a Single Board Transmitter in the S Band 2-4 Ghz. The design contains DCDC converter , LDO, Synthesizer, FPGA, DAC & RF power amplifier. Which is the nest PCB material to choose ?. Shall i go for I-TERA+HR370 hybrid combination to d
Electronics Forum | Thu Apr 30 22:14:46 EDT 2020 | victorzubashev
Hi everyone, Did you come across a hybrid system of X-Ray inspection system having X-ray SMD component counter capabilities? I haven't seen myself, but that such a solution can be really cost-effective. Thanks
Electronics Forum | Sat Jul 11 04:42:41 EDT 2020 | acouto
During H24G head calibration, the following error appears: "814A000 Hybrid calibration measurement results exceeds range error" Unfortunately the head has already been sent to the mark however the error continues. Can someone give me some tips on how
Electronics Forum | Sun Oct 17 20:00:48 EDT 2021 | ttheis
We have a YesTech AOI which we have been pleased with. I understand they also make xray inspection systems (perhaps hybrid too) so I would recommend talking with YesTech.
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Thu Dec 14 21:10:42 EST 2000 | Jeff
elfego, i used to wwork at a place with the following line layout: * Loader * MPM Hi-E * Triscan Solder Inspection Machine (affectionately called the "Trashcan" by the technicians ;-) * 2 Phillips FCM fast chip mounters * 1 Phillips Topaz "hybrid" (
Electronics Forum | Tue Aug 01 16:42:45 EDT 2000 | Robert Hartmann
Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's