Electronics Forum | Wed May 28 08:46:39 EDT 2008 | ck_the_flip
I've talked to several Applications Engineers and Chemists from a couple of different paste manufacturers and they confirm that the profiles on their data sheets are nothing but guidelines. It's up to you, Process Engineer or Process Tech, to develo
Electronics Forum | Fri Apr 14 07:59:42 EDT 2006 | amol_kane
Hi russ, I am in the process of developing a "hybrid" reflow profile to solder a board that has LF BGAs and leaded solder. Have you encountered a similar situation before? if so what was the "safe" top side temp for the leaded components that was set
Electronics Forum | Tue Aug 01 16:42:45 EDT 2000 | Robert Hartmann
Our company is putting a BGA/CSP package assembly line together. We have been studying different assembly houses reliability (short and long term) monitoring programs. I was wondering if some of you who use BGA's/CSP's for your MCM's and Hybrid's
Electronics Forum | Fri May 21 15:36:54 EDT 2010 | pforister
Erli, Thanks for your feedback. The BGA hybrids were baked before production. I had a particular date code that we dis-continued using. This date code was consistently voiding near or above 25%. The other date codes still produced voiding on ave
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
Electronics Forum | Sun Feb 19 12:07:21 EST 2017 | ctran
Did you use Removal Profile for Rework or Reflow Profile to remove the BGA?
Electronics Forum | Sat May 05 11:57:52 EDT 2007 | mohdfazuwan
i'm looking for BGA Rework Station - Temp Profiler for ERSA. Rit now i facing problem the Temp profile easy to drift from initial setting. Hope some one can advise me what type of Temp Profiler suitable for Ersa BGA Rework station. Hope the profiler
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Fri Jul 21 13:37:35 EDT 2006 | Chunks
Stencil clog on BGA apps. BGA not reflowing all the way - check profile.
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