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International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2015-08-16 09:43:18.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

Panasonic Panasonic CM404/602 NPM Feeder KXFW1KSFA00 72MM Tape Feeder DC24V

Panasonic Panasonic CM404/602 NPM Feeder KXFW1KSFA00 72MM Tape Feeder DC24V

Parts & Supplies | Assembly Accessories

Detail Information: 1, Part Name: Tape Feeder 2, Part Number: KXFW1KSFA00 3, Model: 72mm 4, Machine: CM402/602 NPM Machine 5, Voltage: DC24V 6, Brand: Panasonic Panasonic CM404/602 NPM Feeder KXFW1KSFA00 72MM Tape Feeder DC24V KXFW1KS

KingFei SMT Tech

Panasonic KXFW1L10A00 88mm feeder with sensor original new for CM

Panasonic KXFW1L10A00 88mm feeder with sensor original new for CM

Parts & Supplies | Pick and Place/Feeders

KXFW1L10A00 88mm feeder with sensor original new for CM We provide CM602/CM402/NPM Feede, 4mm- 108mm , original new and used both in stock .  This kide of feeder is the bigger one ,it always use for big chigs , such as connect , IC ...etc., pa

ZK Electronic Technology Co., Limited

Juki 40000575+40000576 cylinder driver include cable 40023687 valve PV-1303050-00

Juki 40000575+40000576 cylinder driver include cable 40023687 valve PV-1303050-00

Parts & Supplies | Pick and Place/Feeders

40000575+40000576 cylinder driver include cable 40023687 valve PV-1303050-00 Description: JUKI DRIVE CYLINDER Part No: 40000575 / 40000576 Condition: Original new Payment Term: T/T, Paypal, Westernunion are all allowed. Shipping Ways: DHL, Fed

ZK Electronic Technology Co., Limited

IPC Welcomes U.S. Presidential Determination Prioritizing Domestic Development of Printed Circuit Boards and IC Substrates

Industry News | 2023-04-03 13:24:06.0

IPC welcomes the action of U.S. President Joe Biden today in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).

Association Connecting Electronics Industries (IPC)

SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing

Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,

SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing

Surface Mount Technology Association (SMTA)

2009 SMTA Anaheim Academy Program Announced

Industry News | 2008-12-06 02:08:39.0

Anaheim, CA � The SMTA is pleased to announce the 2009 SMTA Anaheim Academy program. SMTA Anaheim will be held February 10-11, 2009 at the Anaheim Convention Center in conjunction with Electronics West. This year's program will feature six half-day Courses led by leading instructors in the industry.

Surface Mount Technology Association (SMTA)

IPC Applauds New U.S.-Canada Partnership to Strengthen Advanced Packaging and Printed Circuit Board Manufacturing in North America

Industry News | 2023-03-27 13:12:28.0

The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:

Association Connecting Electronics Industries (IPC)

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness

Industry News | 2016-09-15 18:08:04.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)


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