Electronics Forum | Tue Mar 18 11:53:58 EDT 2014 | sara_pcb
Our contract manufacturing agency have procured pcbs from approved vendor. After assembly we found solder mask separated from the PCB on the epoxy area as patches. The top side is intact. also over the pcb tracks, the mask got damaged. In what c
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Wed Jun 14 20:05:51 EDT 2000 | Raeto Zryd
Hi Jason, Zero defect is the only acceptable quality!! U need to ask yourself how capable is your process and how well is you quality system set up. No point in setting goals unatainable or beeing forced upon by management if the root problems of th
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Wed Jan 08 16:27:11 EST 2020 | rmitchell
We have a PCB with the dual sided connector that slides on from the edge and has leads on the top and bottom sides of the PCB. It has 20 leads on each side of the PCB with with about .8mm pitch. The PCB also has a gold grounding strip on the edge fo
Electronics Forum | Sat Oct 24 13:03:20 EDT 2015 | mikekeens
With regards to PCB surface finish I would recommend Electroless Nickel Immersion Gold (ENIG) because of the long shelf life, tarnish resistance, RoHS-compliance, and easy soldering compared to other surface finishes. http://www.surfacemountprocess.
Electronics Forum | Sun Jan 31 14:03:41 EST 1999 | Dean
| I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the ant
Electronics Forum | Tue Nov 27 12:18:08 EST 2001 | Justin
We are currently looking for a way to measure pcb stress during our assembly process. We would like to get an idea of what amount of stress (flex) the boards are undergoing. We would also like to use this to compare a few different processes--for e
Electronics Forum | Mon Jul 23 18:42:50 EDT 2001 | johnmaetta
We are currently re-thinking our policy of no-clean and would like more information from users of both process'. Our assemblies exhibit residue and other 'contaminates' and this raises questions at our customer sites. Thanks, John
Electronics Forum | Fri Jan 20 13:25:07 EST 2006 | Gary Kemp
The mask/copper layer is exhibiting popcorn blistering following reflow. With profiling we know that the assembly does not see anything close to 250 C, rather around 238 C.
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