Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Thu Jan 27 20:32:01 EST 2000 | Dave F
Kyungman: So, your boss is trying to get you to put a wet paste inspection machine on your line after the printer. Sounds like you have a bunch of toys and someone wants to give you more!!!! Ah, the burdens some people have to live with!!! ;-) J
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon
| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t
Electronics Forum | Thu Apr 01 03:04:22 EST 1999 | Scott Davies
Dave, Thanks for the interest. Basically, we looked at this project as a straight swap, i.e. printing the glue on the PCB using a Dek screen printer instead of our current method of dispensing glue using a Camalot dispensing machine. For the PCB we
Electronics Forum | Sat Aug 17 07:34:36 EDT 2002 | bentzen
Hi Ken First of all, I think you are right to point out that the uptime should be calculated on the SMD line bottleneck. But I have some comments to your posting in general: The SMD line bottleneck, you say, is always the palcement machine. This i
Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.
The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h
Electronics Forum | Fri Sep 20 10:27:21 EDT 2002 | Dick Russell
Wow, you have received a lot of suggestions and opinions. Here is one more for the record. First try to improve the performance of your sub-contractor. While you are doing that start bringing in low quantities of parts to develop your in-house cap
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
.gif)
