Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Tue Jun 30 18:40:07 EDT 1998 | Earl Moon
| I would be very grateful if someone could provide me with recent figures (schemes)of | 1. pin through hole assembly | 2. hybrid circuit | 3. surface mount technology. | Or could anyone tell me where I can find such information? | Thanks a lot. | Ma
Electronics Forum | Mon Aug 13 18:21:54 EDT 2001 | delnosa
Trying to find out if there are any data/articles/references out there that looks at the reliability of using SMC�s over interconnects(connectors). The dilemma is having a daughter card with a board-to-board connector vs. having the components (dis
Electronics Forum | Sat Jul 13 09:00:44 EDT 2002 | davef
One of those pick your poison things, eh? * Reduce tester time and labor versus not testing the board after seperation from the panel * Traces that connected to the common bus will have exposed copper after seperation from the panel. This is not rec
Electronics Forum | Tue Jul 16 07:16:36 EDT 2002 | davef
I know Interconnect Systems [708 Via Alondra Camarillo CA 93012 805.482.2870 fax 8470 isipkg.com ] does converters [BGA/BGA, BGA/QFP, BGA/PGA, etc] like you seek. Other places to try are: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2
Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef
Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled
Electronics Forum | Mon Dec 16 09:36:54 EST 2002 | russ
I have never had this problem. It sounds like you are right in imagining that there must have been a bad supplier of PCBS or an inadequate design rule being followed, or a very bad wave process to have this cracking over wave solder. Some books requ
Electronics Forum | Sat May 24 07:21:51 EDT 2003 | davef
Try: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2654fax2656 * Emulation Technology 408.982.0660 800.232.7837 fax 0664 emulation.com * Interconnect Systems (BGA/BGA, BGA/QFP, BGA/PGA) 708 Via Alondra Camarillo CA 93012 805.482.2870 fa
Electronics Forum | Thu Jun 19 20:47:57 EDT 2003 | davef
Your solders could have vasty different liquidous points. Check with your suppliers to determine the appropriateness of the materials you have selected. Awhile ago Jim Zanolli at Teka hosted an OnBoard Forum here at SMTnet. He'd be happy to give y
Electronics Forum | Tue Sep 16 23:58:03 EDT 2003 | iman
interesting! I recently invested a small personal fortune into books nad other related literature to boost my understanding the scientific properties of materials used in electronics and interconnection packages. One area( one of many areas) of p
