Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
Technical Library | 2019-08-19 09:46:13.0
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Industry News | 2010-04-27 09:28:47.0
BANNOCKBURN, Ill., USA — As U.S. companies in the electronics interconnect industry roll up their sleeves to get down to business at IPC’s Capitol Hill Day, two Washington insiders will be sharing their insights on influencing public policy. IPC’s Capitol Hill Day on June 9–10, 2010, will feature Charles “Charlie” Black, Jr. and U.S. Rep. Maurice Hinchey of New York as the keynote and luncheon speakers respectively. The event will focus on influencing legislators on issues critical to the global competitiveness of the electronic interconnect industry.
New Equipment | Education/Training
Continuing the educational series for PCB Design, the IPC Advanced Designer Certification or CID+ (Advanced Certified Interconnect Designer) is the ultimate professional industry certification for a designer looking to obtain what we would consider t
New Equipment | Education/Training
The IPC Designer Certification or CID (Certified Interconnect Designer) is the industry’s premier professional development program directly focused on PCB design philosophy and requirements. If your passion is the transformation of electrical schemat
Industry News | 2008-09-12 03:52:21.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2024-02-12 14:07:03.0
The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Density Interconnect Symposium will be held at the Peoria Sports Complex.
Industry News | 2024-03-18 11:59:32.0
The SMTA is excited to announce a Workforce Development Breakfast Panel, "Building Tomorrow's Expertise," taking place on March 26, 2024 in Peoria, Arizona, USA. The panel will be held at the Peoria Sports Complex, in conjunction with the SMTA Ultra High Density Interconnect Symposium.
