Electronics Forum | Wed Jun 11 11:40:12 EDT 2014 | rgduval
As has been mentioned, it's likely that the component is moving in the tape, and flipping over. It is not likely that the pick/place operation is causing this. What I haven't seen mentioned is that there is an acceptability criteria in IPC for inve
Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean
Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou
Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean
Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F
| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w
Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur
John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai
Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies
Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected
Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis
| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots
Electronics Forum | Fri Jun 05 13:06:14 EDT 1998 | Steve Schrader
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
