Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris
IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Wed Nov 03 15:55:42 EST 2004 | davef
Dennis: The IPC-A-610 requirements are seperate. * You need to meet all acceptance requirements, in order to be in compliance. * If you reject a part for any reason, you are not in compliance.
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong
Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on
Electronics Forum | Thu Aug 31 07:42:25 EDT 2006 | davef
IPC-SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments
Electronics Forum | Wed Nov 28 12:33:01 EST 2001 | tonkowa
Did you have any luck in finding an acceptance criteria that QA accepted? We have had excellent results on signal pins of D-sunb connectors but the grounding prongs dod not meet IPC standard 610C, 4.3 Thanks, John
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