Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef
The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o
Electronics Forum | Fri Apr 20 07:12:22 EDT 2001 | wbu
Dougie, oh yes, it�s a bit short that chapter. I have the Revision e in front of me and this one contains in the appendix the needed IPC-TM-650 Test method for bow and twist. Can�t think that they don�t have that in the new revision. Hope you find
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Tue Mar 29 09:54:20 EST 2005 | chon
Indy, Please refer to IPC-TM-650 TEST METHOD MANUAL Number 2.4.21.1, this is the closest written procedure I've found and used for this. I hope helps or if someone has any other input please advise. On more thing I have this file just let me know if
Electronics Forum | Tue Dec 23 08:31:34 EST 2014 | proceng1
I know the contract rules, but this is idiotic. I did find the 10.2.6 spec already, but I had not looked at the TM-650. I'll check that out, thanks. I also may have found another part that has a better clearance, so I also hope to use these specs
Electronics Forum | Tue Jun 23 05:52:15 EDT 2020 | ameenullakhan
Hi dave, Thanks for the input. your valuable feedback always help. which method is better Spindle or T-bar. IPC TM 650 have are considered as standard methods. 1. T bar 2. Spindle. since we have never used it. we are bit confused. Which would be
Electronics Forum | Fri Jan 31 13:55:56 EST 2003 | MA/NY DDave
Hi I hope I am on point based on my reading. The outer edges bow spec depends on a gradual deformation that finally builds up to the outer edges. If you mathematically move this deformation back you will have allowable deformation at the point you
Electronics Forum | Thu Feb 27 12:27:10 EST 2003 | stevel
Hi all, We got some bare pwb in our incoming inspecion looked really wrapped. The maximum twist of the pwb we messured is 0.056inch by following the method in IPC-TM-650 2.4.22 C. (The diagonal size of our pwb is 7.5inch) According to the IPC standa
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
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