Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef
From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n
Electronics Forum | Thu Jan 12 12:27:44 EST 2006 | johnw
Hi Guys I think you should all be looking at the Nousstar lead free machine this machine has been approved with some of the larger oems and has a good base in Europe and the uk we have one and the design is excellent we are using Aim for class 3 prod
Electronics Forum | Mon Jun 03 16:21:11 EDT 2013 | stefgaudreau
Hi, I have a design were power supply multi strand wire (AWG18) are soldered directly on the pcb (thru-hole) by wave soldering process. I don't have any ferrule on the wire. I would like to know if the IPC standard allow this for class 3 assembly
Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef
First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Thu Jul 18 15:21:32 EDT 2002 | gdstanton
Steve, Seriously we really do that much. Don't know much about your stuff but our designs typically have as much as five 144 pin QFPs on each CCA. Boards are small and double sided with BGA and uBGA. We build some high reliability space stuff and w
Electronics Forum | Wed Sep 21 16:23:36 EDT 2005 | 14367
I was going to ask the same question. As was mentioned, it depends on the classification of product. If it's IPC Class 3, with a requirement for high reliability, I'd want the OEM manufacturer to have a defined statement on this issue for more that
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Mon Jul 15 18:11:36 EDT 2019 | slthomas
First question - is your company already compliant with and/or certified to AS9001? If not, is your company compliant with and/or certified to ISO 9001:2015? There are several overlapping requirements. If the answer is no to the previous and you pla
