Electronics Forum | Tue Sep 02 22:23:27 EDT 2008 | davef
ANSI-J-STD-001: * Temperature and Humidity * Lighting * Maximum noise limit * Eating, drinking, and using tobacco products in the workarea ANSI/ESD S20-20-1999, Table 1- ESD Control Program
Electronics Forum | Thu May 31 10:25:19 EDT 2012 | edmaya33
J-STD-001E, 8.3.6.2 states 1.56um/cm2 NaCl value.
Electronics Forum | Thu May 31 21:43:44 EDT 2012 | davef
edmaya33, you're correct about what J-STD-001E says, but recognize that the measure that you refer us to in not IC [Ion Chromatography]. It is modified ROSE [Resistivity of Solvent Extract] ... or whatever they call modified ROSE now-a-days
Electronics Forum | Fri Oct 26 17:20:15 EDT 2012 | joeherz
Hello, I need to find a wire tinning pot with temp control that will conform to J-STD-001 requirements. I'm looking at American Beauty and Plato models. The American Beauty models appear to be capable but the low prices make me wonder. Any advice
Electronics Forum | Thu May 23 18:10:54 EDT 2013 | davef
I agree with Rob. These solder connections are unacceptable. BR, davef
Electronics Forum | Thu May 23 18:40:48 EDT 2013 | rway
I also agree. Even if it did meet specs, I wouldn't let a joint like this out. Reese
Electronics Forum | Tue Sep 06 12:41:52 EDT 2016 | kmclain
IPC J-STD-001 does not allow solder inspection to be combined with coating inspection for classes 2 and 3.
Electronics Forum | Mon Feb 21 20:15:49 EST 2022 | arminski
since IPC-J-STD-001 RevH obsoleted the 1.56ug/cm2 UCL of ionic contamination tester in testing using ROSE test, how do you define the acceptable limit per PCB assembly? thanks
Electronics Forum | Wed Dec 14 19:49:11 EST 2011 | joeherz
Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-001E and I have a question for those in the know. This section of the standard says the following: ----------- Electronic/mechanical components (includi
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
