Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
Electronics Forum | Wed Feb 08 11:46:19 EST 2023 | tommy_magyar
Yes, your statement is correct. J-STD-033B.1 section 5.3.3.2 SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be considered equivalent to storage in a
Electronics Forum | Fri Feb 10 05:34:55 EST 2023 | ysundar71
Thanks for the comments. As per D Revision of J STD033, clause 5.3.3.2: Dry cabinet at 5% RH SMD packages not sealed in a MBB may be placed in a dry atmosphere cabinet, maintained at not greater than 5% RH. Storage in these dry cabinets may be consid
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Sat Apr 27 15:42:53 EDT 2019 | davef
Your ppl are correct, the capacitor is not sealed. So, it is perfectly acceptable for the capacitor to have absorbed moisture. If your ppl don't either prevent moisture absorption or remove the moisture prior to soldering, their component could fail
Electronics Forum | Mon Nov 27 12:17:02 EST 2000 | Dason C
Chris, you are not completely right. Our industrial is following the IPC standard as our guideline. Per IPC J-STD-033 has specify the floor life at para. 8 (normal condition at 30C/60%RH). If Victor can control his environment at 32% then the compo
Electronics Forum | Tue Sep 19 11:28:09 EDT 2000 | Wolfgang Busko
Mikeal�s approach is one of the more cautious ones. IPC/JEDEC J-STD-033 clause 8.6 talks about 200�C body-temperature not to be exceeded and how it�s best measured. If you go for that method and you made sure that in your wavesoldering (that�s what
Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette
As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
