Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley
Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are
Electronics Forum | Wed May 07 15:26:05 EDT 2008 | joeherz
Interesting - We're using the same AIM products as you. On the lead free, 353, did you start out with it or did you try the WS485? That was the 1st product recommendation we got from AIM and we found that the lot to lot consistency was not good. T
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Tue May 22 16:07:31 EDT 2007 | francitj
We are doing a field study to test the placement accuracy and calculate cpk of some machines in our plant. From previous readings, it is suggested that you buy glass board kits from Accuspec, Topline, etc. Is that the easiest/cheapest way to go abo
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet
Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F
| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha
Electronics Forum | Tue Feb 24 15:52:58 EST 2015 | swiese242
We currently have around 20k+ components in stock. I would like to have some opinions on creating a more lean manufacturing system. We check stock in our system and then order parts. Most of time leading to employees looking for parts, or shorts. We
