Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman
Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J
Electronics Forum | Tue May 05 11:12:01 EDT 2015 | anirudh_thabjul
Thankyou once again dude. Please Don't mind it. I have one more doubt regarding the Max.Power Rating of SMD Resistor. ---"Is same principle which you told application for Maximum Power rating Of SMD Resistor also"?--- i.e Higher Powerrating is
Electronics Forum | Mon Sep 07 02:10:37 EDT 1998 | Tom Blum
Hi Dick We've built up an SMD line for low volume, high product mix over the last two years. Some thoughts: - the reflow system shall have very big thermal power and reserve that results in the same profil with different thermal masses ie products. T
Electronics Forum | Mon Aug 22 07:10:44 EDT 2005 | davef
We see this after exceeding the maximum temperature of the component.
Electronics Forum | Thu Sep 06 01:12:43 EDT 2001 | Dreamsniper
Hi, What's the maximum track width that is allowed to be attached to a 0805 component land pattern. I have a 70 mil x 45 mil Land for my 0805 and is attached to a 50 mil wide track with a length of 300 mil to 1500 mil. Components affected are mostly
Electronics Forum | Wed Dec 11 11:26:20 EST 2013 | aaronpavone
Thanks! Some component data sheets were specific in terms of where the maximum should be measured from. But most did not. I completed my testing. Thanks.
Electronics Forum | Fri Jun 04 17:41:17 EDT 2004 | ricardof
Hi to all, I have one question that I hope to receive comments - Does anyone know or have any experience for the maximum boards you can run on a SMT line, this is quite general, but let's consider a board 8" x 8", about 400 components. Regardless of
Electronics Forum | Mon Sep 29 20:06:22 EDT 2008 | davef
One common definition of a SMD footprint is: A typical SMD footprint, is composed of: * Solder lands (conductive pattern) * Solder resist pattern * Occupied area of the component * Solder paste pattern (for reflow soldering only) * Area underneath th
Electronics Forum | Tue May 26 10:23:53 EDT 2009 | mun4o
hi, i am proccess eng solder wave process.I have problem with a PCB.There have ceramic SMD capacitor, SMD thermistor and SMD inductor 1uH.After reflow all is OK, but after SW these components are broken???The pin is separated from the body???the que
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
