Electronics Forum: metal substrates (Page 7 of 9)

Re: Off Pad Printing

Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F

snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad

Re: Pad Sizes

Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours

| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .

Re: Cold Welding Phenomenon

Electronics Forum | Mon Mar 09 10:12:43 EST 1998 | Justin Medernach

| Cold Welding | I'm presently doing a project on reflow profiling. | I came across this expression. Can someone please give me a definition. | Best Regards | Tom Mc Grath Tom, I think what you are referring to is also called cold solder. You have

Re: Sn/Ag Terminations with Sn/Pb Solder

Electronics Forum | Sat Jan 06 10:27:07 EST 2001 | Dave F

This is a very timely topic, as we drift [buffeted by the combined wind of everyone down-stream in the supply chain ] on waves carrying all of us from the land of lead to the land of no-lead. I want to say there was a recent trade journal article pu

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Re: Parylene Coating of Plastic Parts

Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian

Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon

| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox

| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon

| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t

Re: Altera PQFP240 Solderability

Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X


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