Full Site - : microvias test (Page 7 of 10)

Practical Components Announces PCB200-Thermal Cycle Availability

Industry News | 2010-07-16 16:08:56.0

Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.

Practical Components, Inc.

Colonial Circuits Hosts Annual IPC DFM Workshop

Industry News | 2012-09-12 15:01:25.0

Colonial Circuits will once again be hosting the annual IPC Design for Manufacturability workshop to be held Wednesday and Thursday September 19th and 20th. 2012. This will be Colonial's eighteenth year hosting this important event.

Colonial Circuits, Inc.

Case Study: Dual spindle technology- Should it be a trend?

Industry News | 2011-10-13 04:38:26.0

How are drilling and routing machines and equipment manufacturing companies performing? What strategies do they employ? What is the value of dual spindle technology and is it a global trend? To answer the third question, first you'll have to keep on reading about this fascinating technology which is becoming more and more important in the US, as well as in Asia.

APROS Int. Consulting & Services

The Benefits of Embedded Discrete Components

Industry News | 2018-10-18 10:29:29.0

The Benefits of Embedded Discrete Components

Flason Electronic Co.,limited

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Via-in-pad

Electronics Forum | Mon Jan 17 19:29:54 EST 2000 | Michael Allen

I'm searching for technical papers on the topic of via-in-pad (through-vias, not micro-vias) -- hopefully with reliability test results. There's been zero response to this question in the past, but I thought I'd ask again. References would be great

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon

| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon

| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc


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