Used SMT Equipment | Chipshooters / Chip Mounters
=1) Vision recognition ±0.04mm Feeder inputs Max. 80 on 8mm T/F*6 *1 Please ask for details on E size board. *2 When using MNVC. (option) *3 When using both high-resolution camera and MNVC. (option) *4 Effective
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
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Parts & Supplies | Chipshooters / Chip Mounters
161086 SPRAY BAR, 320mm VORTEX USC 161037 CLEVIS PIN 1/4"x1", SPRUNG BALL 161015 VACUUM ADAPTOR, 320mm VORTEX 161014 TOOLPLATE, 320mm VORTEX USC 114245 WASHER 107265 ELBOW F/F 161112 SPRAY BAR, 520mm VORTEX USC 161111 VACUU
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Parts & Supplies | Chipshooters / Chip Mounters
FUJI CP643 Z AXIS BALL SCREW AWSZ8043 WPA0705 PIN H4403A BEARING,NEEDLE WPA0691 HOLDER,PIN R5023T PIN,NEEDLE WPA1791 HOOK,SPRING WPA5160 PLATE,END WPA0591 PIN WPA0954 PIN,LOCATING WPA1161 BKT WPA5142 CYLINDER,AIR WPA0581 PIN H4401A BEARI
Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
E86507550A0 AC SERVO CONTROL C.BOARD ASM. E8651700000 MOTHER BOARD (P1.52 ROD) E8651705000 CUP BOARD E86517050A0 BOARD E8651715000 ARCNET PCB E86517150A0 ARCNET PCB ASM.(MAIN FRAME) E8651715AA0 ARCNET PCB A ASM.(HLC)
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
