Electronics Forum | Wed Jan 31 17:04:22 EST 2001 | williamh
Hello all, I am having a problem with solder balls on chip resistors and chip capacitors. I have searched the archives and found some information concerning solder balls but have a couple more questions. 1. What is the realistic industry standard f
Electronics Forum | Sat Feb 20 16:16:07 EST 2021 | ttheis
The plan for this machine is shooting thousands of mid power LED chips onto panels with one or two connector parts. From what I have seen watching video footage of the ac-30 vs ax-72, the ac-30 will be much faster for this chip shooting application.
Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Mon Jul 10 12:20:50 EDT 2006 | SWAG
Should look like a void (light spot in the ball pattern). Might even not show much detail like a void does, could look more like the perimeter of the chip in the x-ray or the detail you see between balls in the x-ray. Depends on how good the shot i
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef
Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai
Electronics Forum | Tue Aug 17 14:34:27 EDT 2010 | davef
Comments are: * Too much paste ... reduce it more. * Do not let a traces run between small discrete pads or the heat of reflow will pull a ball to the trace, we can repeat this. * Change the placement height on chip parts to reduce solder spread / mu
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Wed May 02 13:59:20 EDT 2001 | kt
Can anyone tell me what they think is the main cause of excessive solder at the end of the lead after wave. These are not solder peaks as if the leads were cold. It is a well wetted ball of solder on end of the lead. Also, some times you see excessiv
