Electronics Forum | Thu Feb 19 00:31:55 EST 1998 | Larry
The type of training I am looking for is things like micro BGA, flipchip, COB, new processes and techniques, ect. I already work with things like fine pitch QFP's, high mix double reflowed boards every day. I live in Vancouver, but I can drive to Sea
Electronics Forum | Thu Dec 08 10:48:21 EST 2005 | JP
Thanks Russ. As I was writing the post, it crossed my mind that stencil thickness is probably incorrect. I did not question the thickness because it was something that has been discussed with our stencil fabrication shop. When we were ordering mini
Electronics Forum | Wed Sep 23 20:48:03 EDT 1998 | Dave F
| Konichi wa "SMT-netter" sans... | I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. | Found a lot of test and burn-in sockets for CSP's (at more than $1,000 pe
Electronics Forum | Tue Aug 01 12:38:13 EDT 2006 | razor9114
I would go with a 5 mil stencil as well, we experienced some similar issues with micro BGA's and the area ratio was suspect as well as the MESH size of the paste. We went to Type IV paste and verified our area ratio and everything ran beautifully. Pa
Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn
Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea
Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli
Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
