Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John
Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su
Electronics Forum | Fri Jul 09 16:32:35 EDT 1999 | John
Thanks everyone. I appreciate the help. John | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | Q #2) When speaking of annular
Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Fri May 31 14:36:12 EDT 2002 | russ
does anybody have any info on what the minimum kV power should be on an X-Ray machine to handle general BGA inspection? I have heard that you need a minimum of 100 kV for the Metal top packages but have also heard of people using 50-60 kV but I don't
Electronics Forum | Thu Mar 10 15:10:07 EST 2005 | bandjwet
In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum me
Electronics Forum | Fri Jan 06 17:20:47 EST 2006 | davef
Mike You get what you ask for. We ask for 0.001 inch minimum. If your supplier's published process range allows thickness below 0.001 inch minimum, you need to define your own acceptance criterion. We don't use average measurements in lot inspect
Electronics Forum | Tue Dec 05 04:30:02 EST 2017 | jan_pedersen
You find good information in IPC-4554 that includes recommended total Sn thickness and recommended free Sn. It refers to how much usable Sn is needed to meet coating durability categories defined in J-STD-003. As example, if you need 6 months shelf l
Electronics Forum | Sat Jan 11 09:56:15 EST 2020 | jakapratama
There's a lot of parameters to consider in defining stencil life cycle. Average squeegee pressure used, in-process cleaning frequency (auto and manual), physical appearance over time, tension reading over time, and so on to decide how many print cycl
Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef
Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a
Electronics Forum | Fri Mar 03 14:08:55 EST 2000 | Michael Parker
Your best answer for determining cleaning method is to contact your stencil supplier and follow their recommendation. Periodic inspection of your apertures (using microscope, or minimum 10x magnification) would also be a good idea to make sure that g
