Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Thu Apr 14 09:45:58 EDT 2016 | emeto
Why don't you fix the PCB flatness instead? If that is not the problem, I will check the part warping during the reflow process.If the part is large as you mentioned, it probably warps a lot during reflow. Try to bake the parts in front,based on MSL
Electronics Forum | Thu May 12 13:26:31 EDT 2016 | kahrpr
Hi Are we talking about a BGA or a resistor. Knowing the type of part would help.
Electronics Forum | Wed Jul 13 05:17:56 EDT 2016 | salini
How the moisture is not effecting the moisture sensitive devices after board assembly solder process when kept inside a cabinet with IP 20 rated?
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
Electronics Forum | Thu Jul 14 02:25:59 EDT 2016 | salini
Thanks Evtimav and davef... We are doing tar potting only over the moisture sensitive device (not all over the PCB) to make sure that it does not get effected by moisture. But am unable to test the reliability of the process. Continuous switching or
Electronics Forum | Thu Jul 14 08:26:15 EDT 2016 | emeto
Here is some more information: "Moisture can increase the dielectric constant, leading to changes in impedance, switching speeds and propagation delay times. " I am not sure if you can accurately measure any of these on your assembly but it looks li
Electronics Forum | Wed Jan 03 01:51:23 EST 2018 | grek
Hello, i would like to ask if there is any differencies when baking components in baker with control huminidity 5% or when baking components in vacuum? is it ok ? or it should not be baked in vacuum? And one more question: Is it possible to bake tr
Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev
Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.
Electronics Forum | Tue Apr 19 17:34:34 EDT 2022 | dwl
Be careful of MSL level 4 or higher devices on the first side. if they sit out 3 days, they will need to be baked before second side reflow or you risk component damage.
