Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev
Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.
Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob
Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body
Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist
Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.
Electronics Forum | Tue Dec 21 17:56:13 EST 2010 | stepheniii
Am I reading your post correctly? You will print PCBs and not populate them until up to 24 hours later? And you can assemble level 3 components at 30C and 90% humidity, you just have to pro-rate the exposure time. (I don't recommend having those con
Electronics Forum | Tue Sep 02 19:00:00 EDT 2008 | jlawson
Another software provider for MSL/MSD Management is Valor's vManage Software MES system.... is scalable so can implement just MSD Management if this is all you need. Can be implemented to even stop SMT equipment and warn operators in real time when
Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
Electronics Forum | Wed Dec 14 04:34:50 EST 2011 | caerleon
I am installing MSL (Moisture Sensitivity Level) Controls in the company. I have been trying to contact manufacturers to obtain the MSL level (1-6) for each family of part they produce. Well i havent had a great response as they say refer to the dat
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Wed May 05 14:37:58 EDT 2004 | Gaz
I'm not in production, but I do repairs by replacing CSP & LGA components on PCB's. Our components are supplied sealed in packs of 5 with a humidity indicator card and desiccant. I recently failed an audit by the company I do the work for because th
