Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef
You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a
Electronics Forum | Fri Nov 16 08:41:34 EST 2018 | davef
Here's a similar thread earlier in SMTnet FORUM -- Soldering to a nickel plated battery terminal [ https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17474&#Message71990 ] We still have our neighborhood Batteries+ attach so
Electronics Forum | Tue Jan 15 22:33:32 EST 2013 | boardhouse
Hi Samuel, The issue your seeing is caused by lack of control of your board shops Immersion gold plating line. I would reject the order back to them. Their gold line baths need to be checked or they had a poor rinse after nickel plate before adding
Electronics Forum | Mon Aug 10 21:52:34 EDT 1998 | Dave F
| | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not
Electronics Forum | Tue Aug 11 07:51:57 EDT 1998 | Earl Moon
| | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, n
Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
Electronics Forum | Wed Jan 31 12:59:53 EST 2018 | fluxgate
Hi Rob, I did check with the board house, and the confirmed that there was no Nickel plating, but that the silver went straight onto the copper in their immersion silver process. Interestingly I've even tested an unplated sample from that board hou
Electronics Forum | Wed Sep 10 02:47:49 EDT 2003 | Dennis O'Donnelll
This is a problem of contamination in the plating bath. Most prominent with white tin and some gold over nickel plating processes. Rather than argue with your vendor over the issue, and to avoid future recurring problems, I use either HASL or elect
