Electronics Forum | Fri Jun 18 16:15:44 EDT 2004 | russ
Damn, we are doing that too! What is the issue there? Russ
Electronics Forum | Wed Jun 16 11:38:50 EDT 2004 | russ
Am I getting confused here? What about the the CBGA packages that we have been doing for 5-6 yrs? We never reflowed those balls since we couldn't due to the alloy. I have been informed that if you increase paste volume to ensure a full fillet aroun
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Tue Jun 15 17:36:32 EDT 2004 | johnthor
I don't recall if a specific alloy was mentioned just that most lead free alloys would not melt with a Pb profile and result in a less reliable joint in the long term. There was also concern about tin whiskers. Try the archives at http://www.ipc.or
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Sat Dec 02 11:35:30 EST 2006 | davef
Best dross remover is to not produce dross. Search the fine SMYnet Archives for previous discussions Dross will not increase signicantly * Another story, that lead-free solders will generate a greater volume of dross than conventional materials, is
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Mon Mar 26 22:42:20 EDT 2007 | sleech
The issue is of drying moisture-sensitive surface-mounted packages is likely to become even more of a baking-headache in light of the upcoming "D" revision to IPC/JEDEC 020. We have taken a simular approach that a major cellular phone firm took in
Electronics Forum | Thu Sep 06 12:49:47 EDT 2001 | Daniel
I am trying to convert a customer from a water wash process to no-clean but am receiving much resistance. They suspect that no-clean residue played a part in field failures they experienced several years ago. They are quoting an AT&T study that state
