Electronics Forum | Wed Sep 17 17:48:10 EDT 2008 | yam6rider
Do anyone know what is typical Nitrogen setting in Reflow oven and Wave oven.? in SCHF= Thanks
Electronics Forum | Tue Jul 26 05:57:27 EDT 2005 | GS
Why you do not try by yourself ? Run some BGA reflow with and without N2 then X-ray the solder joints. Regards GS
Electronics Forum | Thu Oct 16 16:15:36 EDT 2014 | arifa_anees
www.malcomtech.com/Electronics/products_etc2.htmlCachedSimilar www.suneast.com.cn/ www.made-in-china.com/Reflow_Oven please check these sites for your query courtesy by: http://www.rushpcb.com
Electronics Forum | Mon Jun 25 14:26:50 EDT 2001 | gdstanton
I'm trying to hammer out the setup and operational costs to add Nitrogen to our SMT reflow process. Anyone have an idea on how much liquid N2 they consume monthly on an Electrovert or Conceptronics reflow oven? Thanks in advance for your help.
Electronics Forum | Thu May 24 15:07:16 EDT 2001 | caldon
You should be able to get assistance from http://www.airliquide.com/us/ep&a/TechPapers.htm Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org
Electronics Forum | Sun Oct 13 08:53:46 EDT 2002 | greenman
TI found an improvement in solderability on their Ni/Pd lead-finishes by using inert (nitrogen) reflow, but this is an expensive operation for just one part.
Electronics Forum | Sat May 26 04:57:53 EDT 2001 | Brian Sloth Bentzen
Dear Frang. The right O2 level are mostly determined by the products you produce (E.i. PCB surface and component solderability). In reflow I would say the window is between 100 and 1000 ppm, depending on the issues above. Personal I choose a maximu
Electronics Forum | Sun Sep 09 10:53:05 EDT 2001 | bentzen
For reflow soldering, you are correct ! The higher surface tension of the solder paste in nitrogen atmosphere can increase the number of solder bridges if the component or solder paste print is inaccurate. Another defect that might increase is tomb
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Mon Apr 05 13:23:07 EDT 2004 | Ron W
Low-consumption Nitrogen configurations with an on-board O2 analyzer is the ideal way to go. I cannot speak for all oven manufacturers, but ours have N2 fed to the reflow zone only, which to me is really only where you need it. The gauges/flowmeters
