Electronics Forum | Thu Nov 04 21:36:36 EST 1999 | chris
Hi John, Thanks to your reply, just one question is it possible that the solder paste ( flux material )applied to the pads cause the non-wet. regards Chris
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Sun Nov 25 20:47:44 EST 2001 | Yngwie
knock!!!knock!!!Hellooo!!!!!!!
Electronics Forum | Mon Nov 26 21:03:29 EST 2001 | davef
Hehwoo, bin eatin' turkey up at mums house.
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Wed Sep 10 04:23:42 EDT 2008 | gregoryyork
Wheres the Gold layer on the non wetted part of the pad
Electronics Forum | Wed Nov 15 16:14:02 EST 2000 | Scott Welle
We are having non-wet (head in pillow) problems with Altera 484's similar to the problems discussed on 10/27 timeframe. Need contacts to those people having similar problems. Will those who had problems with Motorola 357 (ref Chris and Glenn on 10/
Electronics Forum | Thu Oct 28 20:45:38 EDT 1999 | chris
Hi Dave, We suspect that the organic FM causes the non-wetting problem. FTIR analysis confirm that the FM is a flux residue. Dave we only used FTIR to detect organic contaminants, we also used SEM/EDX to determined the elemental composition of the
Electronics Forum | Wed Jan 31 17:57:07 EST 2007 | blnorman
We've had multiple issues with non-wetting components. You say only one part is not wetting? Profile won't be the culprit, if so you would have more part issues. We've used SnPb with lead-free parts for some time now, no issues. The issues we had
Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny
Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif
