Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1
Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads
Electronics Forum | Thu Jan 03 11:25:07 EST 2013 | dontfeedphils
That's weird, I've never had any problems using the tool while the pot is up to temp. Over-tightened? They don't need to be tightened too much when putting them in.
Electronics Forum | Fri Jan 04 07:28:46 EST 2013 | beej
Thank you guys. I will check this stuff out. It quite possibly could be something we have done wrong. Thanks again for the feedback
Electronics Forum | Fri Sep 28 09:30:07 EDT 2001 | kmorris
Just had a similar phenomenon 2 days ago. May relate to your issue --- or not. Like you, I did a once over looking for mechanical obstruction & couldn't find any. Ran a thermal profile on the offending PCB & all checked out. Looked in end of oven
Electronics Forum | Tue Jan 03 08:17:53 EST 2006 | chunks
We have a conveyor then a FIFO in the middle and a conveyor and a Mag loader at the end. If your oven doesn't have SMEMA (like ours) then you need to the conveyor before each. We trick these conveyors by shorting out the in coming SMEMA so they con
Electronics Forum | Fri Feb 15 17:50:30 EST 2008 | stevek
Creating a sound tin nickel intermetalic takes a bit more energy than other finishes (such as copper or tin). You can achieve wetting, but not have a viable intermetalic. You should cross section some intact boards from that process and see what th
Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost
4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Thu Jan 03 10:32:38 EST 2013 | beej
I was wondering if any of you fine folks had a trick to changing out nozzles for a Pillerhouse Jade Handex. The tool they gave us when we purchased the machine is inadequate at best. I have tried heating the nozzle up, to no avail. Just wondering if
