Electronics Forum | Mon Mar 30 04:33:48 EDT 2009 | 89jeong
Hi all We also met the solder nonwetting problem as below. This happend after reflow and this is Rohs cpmpliant. How do i solve this problem? Thanks
Electronics Forum | Fri Nov 09 04:15:25 EST 2007 | reypal
how about applying solder resist on the area where you have bridging occurs..you may ask your pcb supplier the possibility.
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Apr 02 14:58:49 EDT 2009 | vladig
Hi Peter, Have the plating thickness checked with XRF. If the layer of Au too thin, then Ni can diffuse all the way through it during the first run and the surface won't be perfectly solderable for the second side. it might also have a thin layer of
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Tue Mar 31 05:26:14 EDT 2009 | d0min0
Hello, we had similar problem in the past - when we had to change PCB supplier from a batch of hundreds of boards (NiAu plated, SnPb process) we got 2-3 boards with paste wicking to components leads what we did, was to check the thickness of gold on
Electronics Forum | Wed Mar 27 13:47:24 EDT 2019 | whitelancer64
I am having an issue with aligning vision for solder paste inspection with the PCB in the Momentum machine. The SMT operators setup the profile on the machine, which I then import into Aegis CircuitCAM to add PCB locations. But when I export again, t
Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter
Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from
Electronics Forum | Mon Jan 26 11:14:08 EST 2009 | evtimov
This one might help http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=13630&mc=5 Emil
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