Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Wed May 16 13:40:19 EDT 2007 | slthomas
"I read a study a while back by IBM that showed too strong a vacuum would cause too much moisture to enter the bags." That's what the nitrogen is for. If you pull a vacuum w/o backfilling with something dry, like nitrogen, pretty soon the vacuum ove
Electronics Forum | Mon Jul 16 16:02:08 EDT 2007 | ck_the_flip
I have zero experience with SN100c, but hey, how much different can it be from Sn63Pb37?! We solder large connectors all the time - sometimes these connectors reside on a ground plane area. We've been able to overcome hole fill issues (on 63/37) th
Electronics Forum | Wed Jan 23 15:33:34 EST 2008 | vance66
I am looking to scan small 2D barcodes in-line while the circuit board is on a conveyor. Currently an operator is picking board up off the conveyor to scan them. We want something that is fixed and does not need to much manual alignment from changeo
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Wed Feb 04 03:30:56 EST 2009 | smartasp
Hi All We intend to switch fro SAC305 to SN100C, which has been giving us great test results. Unfortunately we have a technical guy at head quarter, which refuses to accept the SN100C as it has a 10 deg C higher melting point as SAC. I argue besides
Electronics Forum | Mon Dec 21 11:28:47 EST 2009 | lynn_norman
We used Loctite 3609 and never had problems. If memory serves me isn't 3606 a screen print adhesive? First thing I would check is the cure profile of the adhesive. If it doesn't develop full adhesion, could be problems. Nuther question is are you
Electronics Forum | Thu Oct 28 00:01:55 EDT 2010 | emmanueldavid
XPS, Hope the information in the above thread may help to get You right. BTW, Local Fiducial Marks are meant for specific devices in the Circuit Cards & typically selected to overcome offset or precision placement issues faced from Global Fiducial
Electronics Forum | Mon Aug 22 10:15:30 EDT 2011 | davidalvarez
we have never had a problem using no-clean flux as far as far as shorts and testing problems, using high pressure test probes helps overcome this. The problem we have had is if a unit comes back down the line a couple of years later we notice that t
Electronics Forum | Thu Apr 20 03:50:35 EDT 2017 | cromaclear
To overcome the dewetting issues of the past, a number of techniques have been used such as alternating directions on the wetted nozzle; this helps to avoid the solder biasing to one side causing the other side to oxidize and de-wet. Another method o
