Electronics Forum | Thu Mar 08 22:35:13 EST 2007 | davef
Suggestions are: * Procure solderable finishes that have sufficient thickness to avoid intermetallic problems and use storage conditions that do not promote oxide growth problems. * Bagging/sealing boards has been shown to extend storage durations i
Electronics Forum | Wed Oct 29 07:21:59 EDT 2008 | davef
During soldering, the gold dissolves into the solder connection. You solder to the nickel. The gold protects the nickel from oxidation. Corroded nickel is very difficult to solder. So if your gold is thin, it may not protect the nickel from corrosion
Electronics Forum | Wed Nov 20 16:47:10 EST 2013 | aaronpavone
I have a right angle male shrouded connector and the whole set of termination leads is tin lead plated, at least 100 microinches thick. Should the entirety of the lead be conformal coated? Or can we have just the joint coated? I know I have coated le
Electronics Forum | Mon May 09 18:14:54 EDT 2016 | davef
I asked Randi Gates, Electrolube Marketing to join us to help with the conversation. Taking a step back from the Electrolube question, I could envision a 10 minute soak in DI water stripping the gold from a an ENIG board, you know, depending on the
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon
| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
