Electronics Forum | Wed Oct 26 14:20:41 EDT 2005 | TPM
Brian, We have the Mirtec Table Top. It is very good at detecting the component and orientation. It is however only as good as we program it to be. We have seen some limitations in respect to solder connections. I have not found it to be 100% re
Electronics Forum | Mon Oct 23 02:37:02 EDT 2017 | directx995
Hello, I'm looking for a friendly suggestions or best practices for creating Component Database. For example how do you discern different types of SOIC8, with different body size and pitch between leads? How do you categorize and name components? An
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Mon Jan 15 15:33:41 EST 2001 | davef
First, we have never repackage devices, as you propose. Our schedule has us standing at Receiving like panting dogs waiting for the material required to jump the job, much less giving up the time and money to have parts repackaged. Second, fabricat
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Electronics Forum | Tue May 15 15:15:53 EDT 2001 | ohboy
Hi all, I just discovered this forum and I'm very impressed. We have a vendor who recently stopped placing desiccants in the vacuum packaging for our pcbs. (Yes, it's on the dwg!) His reasoning was that the desiccants can degrade the finish on the
Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef
I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability
Electronics Forum | Mon Apr 01 05:05:40 EDT 2019 | robstevenson
I currently have Aegis CircuitCam Version 7.7.12.0 I have corrupted the mydata.mdb Does anyone know where I can get the original copy that came with software as I am not on maintenance contract any more. Also does anyone have a pdf copy of the Aegis
Electronics Forum | Mon Jul 26 10:44:08 EDT 1999 | Boca
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
Electronics Forum | Fri Jun 19 13:40:25 EDT 1998 | Terry Burnette
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike There has been a
