Electronics Forum: package shear standard (Page 7 of 38)

MSD Packaging Standard

Electronics Forum | Mon Nov 20 10:06:05 EST 2006 | jdumont

Yes, we are in the same boat. We get stuff unsealed, not labeled correctly, wrong packaging or all of the above. Im going to sit down with the purchaser here this week and get this figured out. Being packaged correctly still doesnt mean the parts arn

Contamination under chip resistor array

Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef

There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p

SMT Production Tips

Electronics Forum | Thu Oct 27 16:04:05 EDT 2011 | sjs2303

Right folks, i'm sure we have a wealth of experience on here that needs to be tapped into! If you had to give on piece of advice to a fellow SMD operator/production engineer what would it be? I'll get it started, for me you must not over edit packa

Mydata Package Database hints?

Electronics Forum | Wed Oct 01 16:53:05 EDT 2003 | johnpatricelli

We use Mydata PNP equipment, and are quite happy with it's speed and accuracy, especially with the latest version of the Mydata Tpsys software which includes a prototype version of their emergent auto-teach function for package sizes that can handle

PCB packing / shipping standards?

Electronics Forum | Fri Aug 06 11:25:09 EDT 2004 | reg

Hello. I'm trying to find out if there are any standards with regards to how a PCB is packaged and shipped. I'm particulary looking for info in whether or not ESD bags are required for an assembly in a metal enclosure. Thanks.

baking PWB standard??

Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg

Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green

MSD Packaging Standard

Electronics Forum | Mon Nov 20 09:44:07 EST 2006 | Amol Kane

you can reference JESD97 for labeling LF components, also. i have sent a similar letter to our suppliers and am fielding questions ranging from, what is a MBB to why such strict packaging requirements. i was surprised to know that the requirements

Re: HAST Standard for PBGA

Electronics Forum | Fri Oct 02 16:04:47 EDT 1998 | Benji Acosta

Hi Dave, Thanks for your response. HAST is an acronym for Highly Accelerated Stress Testing. Instead of the conventional PCT or Autoclave which requires say 168 hours, HAST can tremendously shorten the time. There has been correlation being estab

Fine Pitch Pad Width Size VS Component Lead Width

Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu

Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we

Re: Solder Joint Strength

Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon

| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st


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