Industry News: packing (Page 7 of 38)

Industry Advances in a New Era at IPC APEX EXPO 2023

Industry News | 2023-02-13 15:24:20.0

From the show floor – where 375 exhibitors displayed a multitude of high-tech machinery and in some cases artificial intelligence – including cutting-edge assembly, testing and inspection equipment, software automation, laser systems, additive manufacturing and factory of the future technologies, to dozens of technical conference sessions and PD courses covering such hot-topic tracks as smart factories, PCB fabrication and materials and high-density interconnects, IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.

Association Connecting Electronics Industries (IPC)

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

High Voltage Reed Relays with interesting packing possibilities to be showcased at Semicon West

Industry News | 2016-06-27 13:38:42.0

Pickering Electronics' newly released Series 67 and 68 Reed Relay range are available for up to 10kV stand-off, 7.5kV switching, with an option of either PCB or flying lead switch connections.

Pickering Electronics

Alcatel and MPower Sign Agreement

Industry News | 2002-04-09 09:16:06.0

For the Development of Innovative Battery Protection ICs

Alcatel

BAE Systems Utilizes VJ Electronix Waffle Pack / Inspection / Counting System to Facilitate Development of New LCS2 Waffle Pack

Industry News | 2021-09-16 06:16:18.0

VJ Electronix, Inc. is pleased to announce that BAE Systems Inc. has been using the XQuik II to solve an industry-wide problem with the industry-standard Waffle Pack design.

VJ Electronix

SemiPack Invests in Additional Hentec/RPS Photon Steam Aging System

Industry News | 2021-05-18 14:19:48.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Adept Technology Introduces ClamPAC™ Robotic Packaging Automation Cell for Case Packing Clamshells

Industry News | 2012-08-08 18:53:06.0

Adept Technology announces the introduction of the new Adept ClamPAC™ at Pack Expo booth #S-1454.

Adept Technology Inc.

Epec Invests Over 250k To Meet Battery Pack Assembly Demands

Industry News | 2017-04-06 09:28:28.0

[April 6, 2017: New Bedford, MA] To meet the high demand for custom battery packs, Epec has recently expanded its New Bedford Massachusetts facility by more than doubling the battery pack assembly space.

Epec Engineered Technologies

Lattice Announces Update to ispLEVER FPGA Design Tool Suite

Industry News | 2010-10-12 12:46:08.0

Lattice Semiconductor Corporation today announced the immediate availability of Service Pack 1 for Version 8.1 of its ispLEVER® FPGA design tool suite.

Lattice Semiconductor

Fancort Industries to Display Its SMT Product Line at productronica

Industry News | 2015-10-21 17:15:18.0

Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:

Fancort Industries, Inc.


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