Electronics Forum: pad and design (Page 7 of 171)

Stencil / Pad design

Electronics Forum | Mon Jun 28 08:25:54 EDT 2004 | Scott Dodge

What is the difference between a smooth finish organic coated bare copper board for fine-pitch components and HASL finish?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej

Hi, what do you mean by collapsed ? Can you describe or send a photo ?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr

Dear Andrezj, i had attached the photos for ur reference Kindly advice.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

BGA pad size

Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef

Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

via in smt pad

Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef

Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne

via in pad

Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie

I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi


pad and design searches for Companies, Equipment, Machines, Suppliers & Information