Electronics Forum | Tue May 04 16:43:41 EDT 2004 | russ
So the only difference between the "regular solderers" and the BGA people is trace repair? If that is it than you should put the pay in range with your PCB repair people. We do not pay any extra for BGA rework since all they do is wick pads (common
Electronics Forum | Mon Feb 21 13:57:37 EST 2005 | JB
Start by verifying the component definition, the thickness is critical. HSP 4796 uses nozzle 81 for 0402's. Make sure is using the right nozzle. If you need to, use the autoteach function to physically teach the dimensions of it, thickness included.
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph
Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The
Electronics Forum | Tue May 31 14:23:16 EDT 2011 | gosswald
I bought an “as is’ Quad IIC package a while back. The machine definitely has issues with the Quadalign Board. The ICs were literally falling off of the board. I am guessing when it was manufactured they did not get the PC board quite hot enough or s
Electronics Forum | Sat May 18 15:19:55 EDT 2013 | isd_jwendell
OK, I've now read all of the documents you referenced. The problem still remains regarding the thermal vias and how to minimize scavenging. All the docs acknowledge top and bottom tenting, and it's problems. TI says don't do it. Plugging is usually n
Electronics Forum | Wed Jun 24 10:17:50 EDT 2020 | kylehunter
> Hi. Guessing that you are operational by now? If > not, consider to use BGA definition and use the > editor to define where the bottom side pads are > or are not. Just our 2 bits input. The Assembleon > X / Yamaha units are quite
Electronics Forum | Wed Jul 04 11:10:56 EDT 2001 | davef
It�s tough to say. You need enough, but you can�t have too much because you slop it all over the pads, but if you have too little � well you get the picture. There�s so many ways to get to the same place. There is no standard. It�s whatever you n
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
Electronics Forum | Thu Feb 10 10:28:56 EST 2000 | Russ
Okay, Okay, here is the rest of the story! These boards were definitely plated, reworked to HASL, The component that is the most succeptable is a 160 pin QFP .5mm pitch. This component has nickel/iron lead frame. Significantly reduced apertures (1
