Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas
I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Fri Jul 21 12:04:09 EDT 2006 | CKH
Hi Folk, recently, i have faced some issue on Components Misaligned (1 pad size way). What could have cause this issue... Thks & Warmest Rdgs CKH
Electronics Forum | Sun Jul 23 18:28:59 EDT 2006 | mika
Please be a little bit more specific about your problem. 1. is it all components on every board? 2. is it only components placed from one machine in the line? 3. is the solder paste registration ok? 4. is this a new product, that have never been runn
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
Electronics Forum | Tue Feb 26 08:02:30 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....)
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | russ |
Thu Feb 24 11:05:53 EST 2000
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
