Electronics Forum | Mon Sep 13 04:11:27 EDT 1999 | Earl Moon
| | hello | | | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would
Electronics Forum | Thu Jan 29 19:01:51 EST 2009 | stevek
Allow me a contrary viewpoint. I've had these things on my floor and had customers get outsourced evaluations done with them. Most expensive boat anchors I've run across. First the good points: The automated scanning and pattern recognition is go
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Fri Apr 30 11:03:27 EDT 1999 | Wade Oberle
| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the
Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly
Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition
Electronics Forum | Wed Nov 13 04:12:20 EST 2013 | hqew2013
Do you design or define PCB layouts? If so circuit board, what rules and checks do you have in place to make sure your results are... optimal? Over the years, I've created a PCB design checklist to keep me out of trouble. I share these nuggets with m
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
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