Electronics Forum | Mon Sep 09 21:58:34 EDT 2013 | mandysmile
there is another reason, find the reason from the base material.
Electronics Forum | Wed Dec 20 11:21:50 EST 2006 | SWAG
We ended up switching PCB suppliers and PCB material altogether. We built 400+ units with the new material and got zero delamination. It's still unclear what the real solution is as we introduced two changes at once. This new supplier is going to
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Fri Sep 29 05:35:50 EDT 2006 | aj
Guys, We have experienced some delamination on 3 of 45 boards so far.(not exactly delamination yet but a gathering of moisture is evident is certain areas). We have the build on hold while we sort it out with the supplier. We are running a Leadfree
Electronics Forum | Fri Feb 01 11:06:07 EST 2008 | wayne123
our company has beed experiencing some delamination on our circuit boards, we have been lead free for a while and haven't been adjusting temperatures, Found out that the board house was doing something wrong in there process, finally was able to prov
Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch
Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer
Electronics Forum | Fri Jun 01 04:05:25 EDT 2012 | grahamcooper22
If you think the root cause is excess moisture in the pcb then try to bake it for longer. Even longer then the manufacturers recommendation. It takes a long time for excess moisture to come out of a pcb. Try 24 hours , then 36 hours and see if there
Electronics Forum | Mon Dec 31 05:14:58 EST 2001 | ronih
Hello, Are there any rules for PCB drying (baking) before assembly; Date code criteria, finish process on PCB, storage conditions.. ect. I know some assemblers that are baking all PCB (not ENTEK!) as default before assembly, is it realy nessesary? i
Electronics Forum | Tue Apr 03 12:00:55 EDT 2001 | Steve
I am looking for standards that describe acceptance criteria for PCB's. Anyone.....anyone.....Buhler. My company is an OEM manufacturer and I want to know what to look for when we receive PCB's from our PCB fab vendor. Specifically, solderability an
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
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