Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Tue Aug 06 08:21:28 EDT 2013 | leeg
I have been asked a question on what procedures we should in case of a PCB delaminating during the reflow process, e.g what gases can be produced and any evacuation /re-entering checks that we should do before allowing the operators to return to thei
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Mon Jul 20 22:40:22 EDT 1998 | Dave F
| | Bare board solderability plays a significant role of forming good solder joint. Currently, I can not find any information about bare board solderability testing procedure or methods. I think the procedure of testing should have some differentiat
Electronics Forum | Fri Apr 04 13:03:00 EDT 2014 | jyo_409
What is the inspection procedure How to test leakage current Is 100% checking is required at IGI inspection What is the shelf life of the capacitor How much period shelf life is recommended for these capacitors How to check the ripple current of thes
Electronics Forum | Wed Jun 02 07:23:04 EDT 1999 | Earl Moon
To you all for comment and summary, The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): 1) A good set of design rules 2) A good set of design rules meeting producibility r
Electronics Forum | Tue Sep 13 09:12:12 EDT 2005 | stepheniii
I couldn't find any sanctioned procedure for dragging a pick across the leads to check for opens. I've never been a big fan of this anyways. Other than visually inspecting under a microscope and touching the leads that look suspect is there anything
Electronics Forum | Tue Feb 26 15:20:12 EST 2008 | schorschimi
The german machines use the same basic procedure as the Compact Systems CS-400E but (to my knowledge) no cut and clinch. Can you give any information about manual visual inspection after stuffing boards with such machine. If stuffing boards without
Electronics Forum | Mon Aug 11 08:47:31 EDT 2008 | davef
Your MPI (Inspection Procedure) is certainly flawed. Your MPI should have caught this on the first board your produced, before it was reflowed. For help convincing yourself the part is rotated 180*, your choices are: * Get the pin-out of the compone
Electronics Forum | Wed Jun 09 12:01:32 EDT 2010 | markhoch
I guess that depends what you're trying to inspect. Are you inspecting solder joints too? If so, I'd wash them first. But that's just me.
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