Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis
My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me
Electronics Forum | Wed Mar 12 15:26:46 EDT 2014 | dan_ems
Hello, in my SMT process I have some problems with the solderability (look like dewetting) on a PCB with finish HASL Lead Free with a composition that is melt at 230 degree Celsius. My oven is with vapor phase and the peak temperature is 230 degre
Electronics Forum | Fri Jun 06 16:25:03 EDT 2014 | spitkis2
Component manufacturers subject their lots to thermal / reflow testing per IPC /JEDEC STD-020. This involves running the parts through an oven 3X with a peak above 260C. I am not certain if passives go through the same test (theoretically they shou
Electronics Forum | Mon Jun 18 08:33:25 EDT 2018 | geethu
Hi,We are in RFµwave assembler and one the customer requirement need conformal coating cover the chipcomponent metalisation solder fillet. We made as per customer requirment and ship the parts to customer. Again the customer do pick & place our compo
Electronics Forum | Wed Jun 21 23:47:28 EDT 2000 | gary
my topside preheat is 97 deg. C and my peak temp. is 230 deg. C with a duration of 4 secs. What would be my Delta ? I suppose 230 minus 97 is equal to 133 deg C...is that right? regards
Electronics Forum | Wed Apr 05 16:27:40 EDT 2000 | M. Vina
Mike, I believe these are two possible sources: Peak (408) 934-2480 Eco-Tel (408) 524-7100 M. Vina
Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik
Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P
Electronics Forum | Wed May 02 13:59:20 EDT 2001 | kt
Can anyone tell me what they think is the main cause of excessive solder at the end of the lead after wave. These are not solder peaks as if the leads were cold. It is a well wetted ball of solder on end of the lead. Also, some times you see excessiv
Electronics Forum | Tue Jun 12 23:25:29 EDT 2001 | chinaren
As you know there will be a lot of residues(such as rosin) left especialy on the peak zone and cooling zone of reflow oven after reflow soldering in a time. who use one kind of effective liquor or effective method to clean the residues ?
Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t
